Wafer Level 3-D ICS Process Technology

- 2008

indgår i serie Integrated Circuits and Systems


Wafer Level 3-D ICS Process Technology
Format:
Bog, hæftet
Udgivelsesdato:
01-12-2010
Sprog:
Engelsk
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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

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ISBN13:
9781441945624
Vægt:
526 g
Dybde:
20 mm
Bredde:
156 mm
Højde:
234 mm
Forlag:
Springer
Format:
Hæftet
  • Forfattere

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    Wafer Level 3-D ICS Process Technology

    - 2008

    indgår i serie Integrated Circuits and Systems

    • Leveringstid 4-6 hverdage
    • Forventet levering 02-07-2019

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