Design of 3D Integrated Circuits and Systems

- Sharma, R: Design of 3D Integrated Circuits and Systems

af

indgår i serie Devices, Circuits, and Systems


Design of 3D Integrated Circuits and Systems
Du sparer Spar kr. 65,00 med Saxo Premium
  • Leveringstid 5-8 hverdage
  • Forventet levering 09-03-2021
Hvis du køber til medlemspris, bliver du automatisk medlem af Saxo Premium. De første 30 dage er gratis, derefter koster det 99,-/md. Medlemskabet fornyes automatisk og kan altid opsiges. Læs mere om alle fordelene her.
Format:
Bog, hardback
Udgivelsesdato:
20-11-2014
Sprog:
Engelsk
  • Beskrivelse
  • Yderligere info
  • Anmeldelser

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text:Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-waferDiscusses the use of interposer technology and the role of Through-Silicon Vias (TSVs)Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs)Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applicationsDescribes large-scale integration testing and state-of-the-art low-power testing solutionsComplete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal-oxide-semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Andre udgaver:

Bog, paperback

Vis mereVis mindre

Udgivelsesdato:
20-11-2014
ISBN13:
9781466589407
Vægt:
590 g
Dybde:
23 mm
Bredde:
156 mm
Højde:
234 mm
Nummer i serien:
33
Format:
Hardback
Forfattere
Bibliotekernes beskrivelse 125 Illustrations, black and white

Vis mereVis mindre

Vis mereVis mindre

Fandt du ikke hvad du søgte?

Hvis denne bog ikke er noget for dig, kan du benytte kategorierne nedenfor til at finde andre titler. Klik på en kategori for at se lignende bøger.

Velkommen til Saxo - din danske boghandel!

Hos os kan du handle som Gæst, Saxo-bruger eller Saxo Premium-medlem. Du bestemmer selv, og vores kundeservice sidder altid klar med hjælp.

Om medlemspriser hos Saxo

Hvis du køber til medlemspris, bliver du automatisk medlem og får del i de mange fede fordele. De første 30 dage er gratis for nye brugere, og derefter koster det kun 99,-/md. Medlemskabet fornyes automatisk, og du kan altid opsige det. Læs mere om fordelene ved Saxo Premium her.

Machine Name: SAXO081